Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials
Crossref DOI link: https://doi.org/10.1007/s10118-023-3023-2
Published Online: 2023-08-22
Published Print: 2024-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ji, Yuan
Han, Shi-Da
Wu, Hong
Guo, Shao-Yun
Zhang, Feng-Shun
Qiu, Jian-Hui
Text and Data Mining valid from 2023-08-22
Version of Record valid from 2023-08-22
Article History
Received: 29 May 2023
Accepted: 27 June 2023
First Online: 22 August 2023
Conflict of Interests
: The authors declare no interest conflict.