Bio-based Epoxy Composites Demonstrating High Temperature Breakdown Strength and Thermal Conductivity for High Voltage Insulation
Crossref DOI link: https://doi.org/10.1007/s10118-025-3254-5
Published Online: 2024-12-25
Published Print: 2025-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Ke-Rong
Dai, Jin-Yue
Wang, Shuai-Peng
Zhao, Wei-Wei
Liu, Xiao-Qing
Text and Data Mining valid from 2024-12-25
Version of Record valid from 2024-12-25
Article History
Received: 10 September 2024
Accepted: 16 October 2024
First Online: 25 December 2024
Conflict of Interests
: The authors declare no interest conflict.