Thermal decomposition of tetrabromobisphenol-A containing printed circuit boards in the presence of calcium hydroxide
Crossref DOI link: https://doi.org/10.1007/s10163-015-0417-4
Published Online: 2015-07-16
Published Print: 2017-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kumagai, Shogo
Grause, Guido
Kameda, Tomohito
Yoshioka, Toshiaki
Funding for this research was provided by:
Japanese Ministry of Education, Culture, Sports, Science, and Technology (MEXT) Grant-in-Aid for Scientific Research (25241022)
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