A study on recovery of SiC from silicon wafer cutting slurry
Crossref DOI link: https://doi.org/10.1007/s10163-017-0591-7
Published Online: 2017-02-18
Published Print: 2018-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Wei-Hao
Hsu, Chih-Wei
Ding, Yung-Chin
Cheng, Ta-Wui
License valid from 2017-02-18