A room-temperature bonding technique for the packaging of hydrogel-based hybrid microfluidic devices
Crossref DOI link: https://doi.org/10.1007/s10404-015-1544-x
Published Online: 2015-01-21
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Santaniello, Tommaso
Yan, Yunsong
Tocchio, Alessandro
Martello, Federico
Milani, Paolo
Lenardi, Cristina
Text and Data Mining valid from 2015-01-21