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High-strength thermoplastic bonding for multi-channel, multi-layer lab-on-chip devices for ocean and environmental applications

Published Online: 2015-08-05

Published Print: 2015-10

Authors

Sun, D. https://orcid.org/0000-0002-5100-2749
Tweedie, M.

Gajula, D. R.

Ward, B.

Maguire, P. D.
Funding

Funding for this research was provided by:

Department of Employment & Learning, N. Ireland (US-IRL 013)

Science Foundation Ireland (09/US/I1758)

National Science Foundation (NSF 0961250)
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Text and Data Mining valid from 2015-08-05

Version of Record valid from 2015-08-05
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Article History

Received: 15 April 2015

Accepted: 19 July 2015

First Online: 5 August 2015

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