Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics
Crossref DOI link: https://doi.org/10.1007/s10409-017-0670-y
Published Online: 2017-05-27
Published Print: 2018-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Meng, Xianhong
Wang, Zihao
Liu, Boya
Wang, Shuodao
License valid from 2017-05-27