Optimization of thermal aware multilevel routing for 3D IC
Crossref DOI link: https://doi.org/10.1007/s10470-019-01513-y
Published Online: 2019-10-12
Published Print: 2020-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sivakumar, P.
Pandiaraj, K.
JeyaPrakash, K.
Text and Data Mining valid from 2019-10-12
Version of Record valid from 2019-10-12
Article History
Received: 27 February 2019
Revised: 19 June 2019
Accepted: 22 July 2019
First Online: 12 October 2019