A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
Crossref DOI link: https://doi.org/10.1007/s10544-014-9906-9
Published Online: 2015-01-29
Published Print: 2015-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chang, Chih-Wei
Chou, Lei-Chun
Huang, Po-Tsang
Wu, Shang-Lin
Lee, Shih-Wei
Chuang, Ching-Te
Chen, Kuan-Neng
Hwang, Wei
Chen, Kuo-Hua
Chiu, Chi-Tsung
Tong, Ho-Ming
Chiou, Jin-Chern
Text and Data Mining valid from 2015-01-29