Analysis of Plane Cylindrical Wafer Defects by the Spectral-Domain Integral Equation Method
Crossref DOI link: https://doi.org/10.1007/s10598-015-9303-0
Published Online: 2015-12-16
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lopushenko, V. V.
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