Crossmark

Analysis of thermally induced delamination of thermoelectric thin film/substrate system

Crossref DOI link: https://doi.org/10.1007/s10704-018-0328-1

Published Online: 2018-11-12

Published Print: 2018-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Cui, Y. J.

Wang, K. F.

Wang, B. L.

Wang, P.
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (11672084)

National Natural Science Foundation of China (11602072)

National Natural Science Foundation of China (11372086)

Natural Science Foundation of Guangdong Province (2016A030311006)

Natural Science Foundation of Guangdong Province (2016A030310367)
License Information

Text and Data Mining valid from 2018-11-12
More Information

Article History

Received: 13 June 2018

Accepted: 1 November 2018

First Online: 12 November 2018