Ultra-wide Bandwidth Inter-Chip Interconnects for Heterogeneous Millimeter-Wave and THz Circuits
Crossref DOI link: https://doi.org/10.1007/s10762-016-0278-5
Published Online: 2016-04-29
Published Print: 2016-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fay, Patrick
Bernstein, Gary H.
Lu, Tian
Kulick, Jason M.
License valid from 2016-04-29