Experimental Pool Boiling Heat Transfer Analysis with Copper–Alumina Micro/Nanostructured Surfaces Developed by a Novel Electrochemical Deposition Technique
Crossref DOI link: https://doi.org/10.1007/s10765-023-03218-x
Published Online: 2023-06-12
Published Print: 2023-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gupta, Sanjay Kumar
Misra, Rahul Dev
Text and Data Mining valid from 2023-06-12
Version of Record valid from 2023-06-12
Article History
Received: 18 March 2023
Accepted: 17 May 2023
First Online: 12 June 2023
Declarations
:
: The authors have no conflicts of interest to declare.