Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions
Crossref DOI link: https://doi.org/10.1007/s10800-020-01414-3
Published Online: 2020-03-09
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Arai, Susumu http://orcid.org/0000-0002-4915-0398
Ueda, Miyoka
Text and Data Mining valid from 2020-03-09
Version of Record valid from 2020-03-09
Article History
Received: 4 October 2019
Accepted: 24 February 2020
First Online: 9 March 2020