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Understanding and preventing Cu–Sn micro joint defects through design and process control

Published Online: 2021-10-10

Published Print: 2022-02

Authors

Njuki, M.

Thekkut, S.

Das, R.

Shahane, N.

Thompson, P.

Mirpuri, K.

Borgesen, P.

Dimitrov, N. https://orcid.org/0000-0003-1787-4575
Funding

Funding for this research was provided by:

Semiconductor Research Corporation (CHIRP, Task 2878.005)

Semiconductor Research Corporation (CHIRP, Task 2878.011)
License Information

Text and Data Mining valid from 2021-10-10

Version of Record valid from 2021-10-10
More Information

Article History

Received: 14 April 2021

Accepted: 25 September 2021

First Online: 10 October 2021

Document is current