Electrodeposition of silicon films from organic solvents on nanoporous copper substrates
Crossref DOI link: https://doi.org/10.1007/s10800-023-01940-w
Published Online: 2023-07-15
Published Print: 2024-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Vivegnis, S.
Baudhuin, L.-C.
Delhalle, J.
Mekhalif, Z.
Renner, F. U.
Text and Data Mining valid from 2023-07-15
Version of Record valid from 2023-07-15
Article History
Received: 4 April 2023
Accepted: 17 June 2023
First Online: 15 July 2023
Declarations
:
: The authors declare no competing interests.