Thermally aware performance analysis of single-walled carbon nanotube bundle as VLSI interconnects
Crossref DOI link: https://doi.org/10.1007/s10825-016-0793-6
Published Online: 2016-02-03
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rai, Mayank Kumar
Kaushik, Brajesh Kumar
Sarkar, Sankar
Text and Data Mining valid from 2016-02-03