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The mitigation of signal integrity issues in coupled MWCNT bundles and a comparison with Cu interconnects

Published Online: 2021-03-19

Published Print: 2021-06

Authors

Mudavath, Raju https://orcid.org/0000-0003-1934-3989
Bhukya, Rajendra Naik

Jeripotula, Praneet Raj
Funding

Funding for this research was provided by:

Ministry of Electronics and Information technology (MEITY-PHD-1898)
License Information

Text and Data Mining valid from 2021-03-19

Version of Record valid from 2021-03-19
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Article History

Received: 23 November 2020

Accepted: 22 February 2021

First Online: 19 March 2021

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