A Test-Ordering Based Temperature-Cycling Acceleration Technique for 3D Stacked ICs
Crossref DOI link: https://doi.org/10.1007/s10836-015-5541-5
Published Online: 2015-11-16
Published Print: 2015-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Aghaee, Nima
Peng, Zebo
Eles, Petru
Text and Data Mining valid from 2015-11-16