Optimization of Test Wrapper for TSV Based 3D SOCs
Crossref DOI link: https://doi.org/10.1007/s10836-016-5610-4
Published Online: 2016-09-05
Published Print: 2016-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Roy, Surajit Kumar
Giri, Chandan
Rahaman, Hafizur
License valid from 2016-09-05
