Repeated Testing Applications for Improving the IC Test Quality to Achieve Zero Defect Product Requirements
Crossref DOI link: https://doi.org/10.1007/s10836-019-05812-0
Published Online: 2019-07-02
Published Print: 2019-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yeh, Chung-Huang http://orcid.org/0000-0002-8249-6171
Chen, Jwu E.
Text and Data Mining valid from 2019-07-02
Version of Record valid from 2019-07-02
Article History
Received: 12 November 2018
Accepted: 13 June 2019
First Online: 2 July 2019