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Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration

Published Online: 2024-02-24

Published Print: 2024-02

Authors

Yu, Shifeng https://orcid.org/0009-0000-2011-8557
Dai, Junjie

Li, Junhui
Funding

Funding for this research was provided by:

National Natural Science Foundation of China’s joint fund for regional innovation and development (U20A6004)
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Text and Data Mining valid from 2024-02-01

Version of Record valid from 2024-02-01
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Article History

Received: 25 October 2023

Accepted: 16 January 2024

First Online: 24 February 2024

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