On the Rationality of Bundled Rebate Program in Modem Chip Industry: an Analysis on Qualcomm’s Case
Crossref DOI link: https://doi.org/10.1007/s10842-019-00311-6
Published Online: 2019-06-29
Published Print: 2019-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ai, Youqiong
Lu, Thomas Y. http://orcid.org/0000-0003-1476-4012
Text and Data Mining valid from 2019-06-29
Version of Record valid from 2019-06-29
Article History
Received: 15 February 2019
Revised: 10 June 2019
Accepted: 18 June 2019
First Online: 29 June 2019