Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys
Crossref DOI link: https://doi.org/10.1007/s10853-014-8473-z
Published Online: 2014-07-30
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Atieh, Anas M.
Khan, Tahir I.
Text and Data Mining valid from 2014-07-30