Zr–Ti–Ni thin film metallic glass as a diffusion barrier between copper and silicon
Crossref DOI link: https://doi.org/10.1007/s10853-014-8770-6
Published Online: 2014-12-10
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Chih-Wei
Yiu, Pakman
Chu, Jinn P.
Shek, Chan-Hung
Hsueh, Chun-Hway
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