Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates
Crossref DOI link: https://doi.org/10.1007/s10853-015-8859-6
Published Online: 2015-01-29
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
He, A.
Ivey, D. G.
Text and Data Mining valid from 2015-01-29
