Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping
Crossref DOI link: https://doi.org/10.1007/s10853-015-9230-7
Published Online: 2015-07-11
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bashir, M. Nasir
Haseeb, A. S. M. A.
Rahman, Abu Zayed Mohammad Saliqur http://orcid.org/0000-0001-8669-3490
Fazal, M. A.
Kao, C. R.
Funding for this research was provided by:
Ministry of Higher Education, Malaysia (D000026-16001)
Text and Data Mining valid from 2015-07-11