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Effect of substrate temperature on interfacial bonding for cold spray of Ni onto Cu

Crossref DOI link: https://doi.org/10.1007/s10853-015-9304-6

Published Online: 2015-08-07

Published Print: 2015-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yin, Shuo

Suo, Xinkun

Xie, Yingchun

Li, Wenya

Lupoi, Rocco

Liao, Hanlin
Funding

Funding for this research was provided by:

Marie Curie (FP7-IPACT-268696)

China State Key Lab of Advanced Metals and Materials (2013-ZD07)
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