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Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

Crossref DOI link: https://doi.org/10.1007/s10853-016-0234-8

Published Online: 2016-08-04

Published Print: 2016-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chen, Guang

Liu, Li

Du, Juan

Silberschmidt, Vadim V.

Chan, Y. C.

Liu, Changqing

Wu, Fengshun
Funding

Funding for this research was provided by:

National Nature Science Foundation of China (NSFC) (NSFC NO. 61261160498)

China-European Union technology cooperation project (No. 1110)

Marie Curie International Research Staff Exchange Scheme Project within the 7th European Community Framework Programme (No. PIRSES-GA-2010-269113)
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