Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu
Crossref DOI link: https://doi.org/10.1007/s10853-016-0386-6
Published Online: 2016-09-15
Published Print: 2017-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Raghavan, R.
Harzer, T. P.
Djaziri, S.
Hieke, S. W.
Kirchlechner, C.
Dehm, G.
License valid from 2016-09-15