Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process
Crossref DOI link: https://doi.org/10.1007/s10853-016-0483-6
Published Online: 2016-10-13
Published Print: 2017-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Baolei
Tian, Yanhong http://orcid.org/0000-0002-5877-7096
Feng, Jiayun
Wang, Chenxi
Funding for this research was provided by:
National Natural Science Foundation of China (CN) (51522503)
Program for New Century Excellent Talents in University (NCET-13-0175)
License valid from 2016-10-13