Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls
Crossref DOI link: https://doi.org/10.1007/s10853-016-0613-1
Published Online: 2016-11-28
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kadoguchi, Takuya
Take, Naoya
Yamanaka, Kimihiro
Nagao, Shijo
Suganuma, Katsuaki
License valid from 2016-11-28