An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates
Crossref DOI link: https://doi.org/10.1007/s10853-017-0851-x
Published Online: 2017-02-10
Published Print: 2017-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Long, Xu
He, Xu
Yao, Yao
License valid from 2017-02-10
