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The dissolution and reprecipitation behavior of the AuSn4 intermetallic compound in a solder joint during liquid-state and solid-state reactions

Crossref DOI link: https://doi.org/10.1007/s10853-017-1312-2

Published Online: 2017-06-27

Published Print: 2017-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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