Crossmark

Electric current-assisted creep behaviour of Sn–3.0Ag–0.5Cu solder

Crossref DOI link: https://doi.org/10.1007/s10853-017-1967-8

Published Online: 2018-01-02

Published Print: 2018-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Long, Xu https://orcid.org/0000-0002-3212-9154
Tang, Wenbin

Xu, Mengfei

Keer, Leon M.

Yao, Yao
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51508464)

National Natural Science Foundation of China (11572249)

Natural Science Foundation of Shaanxi Province (2017JM1013)

Fundamental Research Funds for the Central Universities (3102016ZY017)

Astronautics Supporting Technology Foundation of China (2017-HT-XG)
License Information

License valid from 2018-01-02