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Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding

Published Online: 2018-03-09

Published Print: 2018-06

Authors

Peng, J.

Liu, H. S.

Ma, H. B.

Shi, X. M. https://orcid.org/0000-0002-9653-9734
Wang, R. C.
Funding

Funding for this research was provided by:

National Science and Technology Major Project of the Ministry of Science and Technology of China (2017YFB0305700)
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Text and Data Mining valid from 2018-03-09
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Article History

Received: 6 November 2017

Accepted: 5 March 2018

First Online: 9 March 2018

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