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Effect of annealing on microstructure and thermoelectric properties of hot-extruded Bi–Sb–Te bulk materials

Crossref DOI link: https://doi.org/10.1007/s10853-018-2211-x

Published Online: 2018-03-12

Published Print: 2018-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Zhi-Lei

Araki, Takehiro

Onda, Tetsuhiko

Chen, Zhong-Chun https://orcid.org/0000-0002-4329-6775
Funding

Funding for this research was provided by:

Amada Foundation (AF-2013007)

Nippon Sheet Glass Foundation for Materials Science and Engineering
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Article History

Received: 23 December 2017

Accepted: 7 March 2018

First Online: 12 March 2018

Compliance with ethical standards

:

: The authors declare that they have no conflict of interest.