High thermal conductive copper/diamond composites: state of the art
Crossref DOI link: https://doi.org/10.1007/s10853-020-05443-3
Published Online: 2020-10-20
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jia, S. Q.
Yang, F.
Text and Data Mining valid from 2020-10-20
Version of Record valid from 2020-10-20
Article History
Received: 22 July 2020
Accepted: 24 September 2020
First Online: 20 October 2020