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Vacancy-mediated effects for simultaneously enhancing the Cu/graphene/Al interfacial bonding strength and thermal conductance: a first-principles study

Crossref DOI link: https://doi.org/10.1007/s10853-020-05624-0

Published Online: 2021-01-03

Published Print: 2021-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Liu, Pei

Xie, Jingpei https://orcid.org/0000-0002-0140-5670
Hei, Ruiyao

Wang, Aiqin

Ma, Douqin

Mao, Zhiping
Funding

Funding for this research was provided by:

China Postdoctoral Science Foundation (2019M662491)

National Natural Science Foundation of China (U1604251)
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Text and Data Mining valid from 2021-01-03

Version of Record valid from 2021-01-03
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Article History

Received: 16 October 2020

Accepted: 26 November 2020

First Online: 3 January 2021

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