Improvement in radiation resistance of nanocrystalline Cu using grain boundary engineering: an atomistic simulation study
Crossref DOI link: https://doi.org/10.1007/s10853-022-07877-3
Published Online: 2022-11-04
Published Print: 2022-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Manna, Mouparna
Pal, Snehanshu https://orcid.org/0000-0002-4731-7107
Text and Data Mining valid from 2022-11-01
Version of Record valid from 2022-11-01
Article History
Received: 11 September 2022
Accepted: 25 October 2022
First Online: 4 November 2022