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Flexible and high-temperature dielectric ANF-NFC/mica@PDA composite film with high breakdown strength

Published Online: 2022-11-12

Published Print: 2022-11

Authors

Wang, Yafang

Dang, Wanbin

Yao, Cheng

Tian, Cuiyu

Lu, Zhaoqing https://orcid.org/0000-0002-2095-4405
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (22178211)

Key Research and Development Projects of Shaanxi Province (2021ZDLGY14-05)

the Key Project of Shaanxi Provincial Department of Education (20JY002)
License Information

Text and Data Mining valid from 2022-11-01

Version of Record valid from 2022-11-01
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Article History

Received: 5 June 2022

Accepted: 25 October 2022

First Online: 12 November 2022

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

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