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Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Published Online: 2023-02-27

Published Print: 2023-03

Authors

Qiao, Yuanyuan

Liang, Hongwei

Zhao, Ning https://orcid.org/0000-0001-5509-4989
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52075072)
License Information

Text and Data Mining valid from 2023-02-27

Version of Record valid from 2023-02-27
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Article History

Received: 15 December 2022

Accepted: 14 February 2023

First Online: 27 February 2023

Declarations

:

: The authors declare that they have no conflict of interest.

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