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Inhibition of the formation of aluminum–copper intermetallic compounds in direct-bonded aluminum–copper ceramic substrates by using a silver metallic interlayer

Crossref DOI link: https://doi.org/10.1007/s10853-023-08754-3

Published Online: 2023-07-23

Published Print: 2023-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yu, Ni-Chi

Lin, Kun-Lin https://orcid.org/0000-0003-2462-7812
Lin, Chien-Cheng
Funding

Funding for this research was provided by:

National Science Council (MOST 111-2221-E-492-014-MY2)

National Science Council (MOST 111-2119-M-002-020-MBK)
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Text and Data Mining valid from 2023-07-23

Version of Record valid from 2023-07-23
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Article History

Received: 1 April 2023

Accepted: 5 July 2023

First Online: 23 July 2023

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

: Not applicable.

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