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Preparation of polyimide bond-linked covalent organic frameworks as resin-compatible nanofillers for copper clad laminates with improved thermal and electrical performances

Crossref DOI link: https://doi.org/10.1007/s10853-024-09776-1

Published Online: 2024-05-27

Published Print: 2024-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Sun, He

Wang, Cheng

Zhang, Xiao

Wang, Fengwei https://orcid.org/0000-0002-4730-1578
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (No. 51807083)
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Text and Data Mining valid from 2024-05-27

Version of Record valid from 2024-05-27
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Article History

Received: 16 March 2024

Accepted: 13 May 2024

First Online: 27 May 2024

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