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Research on the enhancement of densification and electrical conductivity of silver-coated copper conductive films via oxidation–reduction sintering method

Crossref DOI link: https://doi.org/10.1007/s10853-025-10638-7

Published Online: 2025-02-01

Published Print: 2025-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Xuewen

Zhao, Jie

Shi, Qingwen

Li, Peibo

Luo, Guoqiang

Shen, Qiang

Sun, Yi https://orcid.org/0000-0002-2556-7543
Funding

Funding for this research was provided by:

The National Key R&D Program of China (2021YFB3802300)

The Key-Area Research and Development Program of Guangdong Province (No. 2020B010181001)

Independent Innovation Projects of the Hubei Longzhong Laboratory (2022ZZ-33)

National Natural Science Foundation of China (Grant No. 52104363)
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Article History

Received: 4 September 2024

Accepted: 9 January 2025

First Online: 1 February 2025

Declarations

:

: The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

: Not Applicable.

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