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Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints

Published Online: 2026-04-28

Published Print: 2026-06

Authors

Hsieh, C. L. https://orcid.org/0000-0003-0686-8794
Coyle, R. J.

Xian, J. W.

Gourlay, C. M.
Funding

Funding for this research was provided by:

Engineering and Physical Sciences Research Council (EP/R018863/1)
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Text and Data Mining valid from 2026-04-28

Version of Record valid from 2026-04-28
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Article History

Received: 29 November 2025

Accepted: 2 April 2026

First Online: 28 April 2026

Document is current