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Copper nanoparticle sintering technology for power electronics packaging-preparation, process, and performance

Published Online: 2026-04-13

Published Print: 2026-05

Authors

Wang, Xiuqi

Zhu, Fengrui

Zhu, Lihua

Li, Mingyu

Ji, Hongjun https://orcid.org/0000-0002-4159-6838
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52175310)

National Natural Science Foundation of China (52232004)

Fundamental Research Funds for the Central Universities (HIT.DZJJ.2023112)

Guangdong Basic and Applied Basic Research Foundation (2024B1515250002)

Shenzhen Science and Technology Plan (KJZD20230923113900001)
License Information

Text and Data Mining valid from 2026-04-13

Version of Record valid from 2026-04-13
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Article History

Received: 28 January 2026

Accepted: 7 April 2026

First Online: 13 April 2026

Declarations

:

: The authors declare no conflict of interest.

: This manuscript does not contain any data which needed ethical approval, and the research does not involve human participants and/or animals.

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