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Void formation mechanisms in the spallation process of copper under different dynamic loading conditions

Published Online: 2026-04-29

Published Print: 2026-06

Authors

Hu, Jianian

Fang, Shi

Zhang, Haotian https://orcid.org/0009-0005-6496-8429
Li, Jiajin
Funding

Funding for this research was provided by:

Natural Science Foundation of Hubei Province (Q20234410)
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Text and Data Mining valid from 2026-04-29

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Article History

Received: 26 September 2025

Accepted: 8 April 2026

First Online: 29 April 2026

Declarations

:

: The authors declare no competing interests.

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