Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder
Crossref DOI link: https://doi.org/10.1007/s10854-014-2014-z
Published Online: 2014-05-20
Published Print: 2014-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hsu, Shou-Jen
Sha, Chu-Hsuan
Lee, Chin C.
Text and Data Mining valid from 2014-05-20