Effect of hold time on the mechanical fatigue failure behavior of lead-free solder joint under high temperature
Crossref DOI link: https://doi.org/10.1007/s10854-014-2100-2
Published Online: 2014-06-19
Published Print: 2014-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Yongxin
Li, Xiaoyan
Gao, Ruiting
Wang, Chao
Text and Data Mining valid from 2014-06-19